Powered by 3rd generation AMD Ryzen 9, Ryzen7, Ryzen 5 AM4 to maximize connectivity and speed with dual M.2, PCIe 4.0, USB 3.2 Gen2 and up to 128 GB of DDR4 (4400 MHz)
With 3rd Gen Ryzen processors, this motherboard features the recent Lightning Gen 4 solution on both PCI-E and M.2 slot, which allow for faster data transfer on graphics cards, storage devices and networking devices
AM4 socket: ready for AMD Ryzen 3rd generation processors.Manageability : WOL by PME, PXE
Connectivity for gaming: ready for PCIe0-ready, dual M.2, USB 3.2 Gen 2 Type-C plus HDMITM 2.1 and DisplayPort 1.2 output support. Seamless networking: Intel 2.5Gb Ethernet with ASUS LANGuard
RYZEN 5000 SERIES, HIGH PERFORMANCE - The MPG X570S EDGE MAX WIFI employs a powerful VRM platform for the AMD X570 chipset (AM4, Ryzen 5000 series ready) with a 12 Duet Rail Power System 75A SPS (8+4 Pin connector)
STYLISH COOLING - High-efficiency VRM thermal dissipation pads (7 W/mK) transfer heat directly to aluminium heatsinks which act in concert via a bilateral heat pipe to regulate peak temperatures; Includes Mystic Light effects and Frozr AI thermal detection
AMD AM4 Socket: Ready for 2nd and 3rd Generation AMD Ryzen processors and up to two M.2 drives, USB 3.2 Gen2 and AMD StoreMI to maximize connectivity and speed
Comprehensive Thermal Design: Active chipset heatsink, M.2 aluminium heatsink and ROG cooling zone
Powered by 3rd generation AMD Ryzen 9, Ryzen7, Ryzen 5 AM4 to maximize connectivity and speed with dual M.2, PCIe 4.0, USB 3.2 Gen2 and up to 128 GB of DDR4 (4400 MHz)
With 3rd Gen Ryzen processors, this motherboard features the recent Lightning Gen 4 solution on both PCI-E and M.2 slot, which allow for faster data transfer on graphics cards, storage devices and networking devices
AM4 socket: ready for AMD Ryzen 3rd generation processors.Manageability : WOL by PME, PXE
Connectivity for gaming: ready for PCIe0-ready, dual M.2, USB 3.2 Gen 2 Type-C plus HDMITM 2.1 and DisplayPort 1.2 output support. Seamless networking: Intel 2.5Gb Ethernet with ASUS LANGuard
RYZEN 5000 SERIES, HIGH PERFORMANCE - The MPG X570S EDGE MAX WIFI employs a powerful VRM platform for the AMD X570 chipset (AM4, Ryzen 5000 series ready) with a 12 Duet Rail Power System 75A SPS (8+4 Pin connector)
STYLISH COOLING - High-efficiency VRM thermal dissipation pads (7 W/mK) transfer heat directly to aluminium heatsinks which act in concert via a bilateral heat pipe to regulate peak temperatures; Includes Mystic Light effects and Frozr AI thermal detection
AMD AM4 Socket: Ready for 2nd and 3rd Generation AMD Ryzen processors and up to two M.2 drives, USB 3.2 Gen2 and AMD StoreMI to maximize connectivity and speed
Comprehensive Thermal Design: Active chipset heatsink, M.2 aluminium heatsink and ROG cooling zone
Powered by 3rd generation AMD Ryzen 9, Ryzen7, Ryzen 5 AM4 to maximize connectivity and speed with dual M.2, PCIe 4.0, USB 3.2 Gen2 and up to 128 GB of DDR4 (4400 MHz)
With 3rd Gen Ryzen processors, this motherboard features the recent Lightning Gen 4 solution on both PCI-E and M.2 slot, which allow for faster data transfer on graphics cards, storage devices and networking devices
AM4 socket: ready for AMD Ryzen 3rd generation processors.Manageability : WOL by PME, PXE
Connectivity for gaming: ready for PCIe0-ready, dual M.2, USB 3.2 Gen 2 Type-C plus HDMITM 2.1 and DisplayPort 1.2 output support. Seamless networking: Intel 2.5Gb Ethernet with ASUS LANGuard
RYZEN 5000 SERIES, HIGH PERFORMANCE - The MPG X570S EDGE MAX WIFI employs a powerful VRM platform for the AMD X570 chipset (AM4, Ryzen 5000 series ready) with a 12 Duet Rail Power System 75A SPS (8+4 Pin connector)
STYLISH COOLING - High-efficiency VRM thermal dissipation pads (7 W/mK) transfer heat directly to aluminium heatsinks which act in concert via a bilateral heat pipe to regulate peak temperatures; Includes Mystic Light effects and Frozr AI thermal detection
AMD AM4 Socket: Ready for 2nd and 3rd Generation AMD Ryzen processors and up to two M.2 drives, USB 3.2 Gen2 and AMD StoreMI to maximize connectivity and speed
Comprehensive Thermal Design: Active chipset heatsink, M.2 aluminium heatsink and ROG cooling zone